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White Paper

Extending Design Technology Co-optimization from Technology Launch to HVM with Calibre Fab Solutions

Extending Design Technology Co-optimization from Technology Launch to HVM with Calibre Fab Solutions

The modern semiconductor design-to-fabrication process mainly relies on intramodular validation mechanisms to prevent the propagation of systematic defects. These validation mechanisms include DRC sign-off of the physical design, verification of optical proximity correction (OPC), metrology and inspection gauging the process, and physical failure analysis to confirm electrical diagnosis.

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