Sunday, June 23, 2024
White Paper

Extending Design Technology Co-optimization from Technology Launch to HVM with Calibre Fab Solutions

Extending Design Technology Co-optimization from Technology Launch to HVM with Calibre Fab Solutions

The modern semiconductor design-to-fabrication process mainly relies on intramodular validation mechanisms to prevent the propagation of systematic defects. These validation mechanisms include DRC sign-off of the physical design, verification of optical proximity correction (OPC), metrology and inspection gauging the process, and physical failure analysis to confirm electrical diagnosis.

Download the whitepaper to learn more.

  This page is FastPass tested and is compliant with Microsoft Accessibility features.

Get Exclusive Access to the White Paper

By downloading this publication, you understand and agree that you are providing your personal information to Anteriad, LLC, and Anteriad may share your personal information with Siemens, pursuant to Anteriad's Privacy Policy. Furthermore, Siemens may use your personal information to provide you with marketing materials and contact you regarding its services, pursuant to Privacy Statement.